Pad arrangement of a circuit module



FIG. 1 is a bottom view of a first embodiment of a pad arrangement of a circuit module showing my new design;

FIG. 2 is a top view thereof;

FIG. 3 is a back view thereof;

FIG. 4 is a front view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a bottom view of a second embodiment of a pad arrangement of a circuit module showing my new design.

All surfaces not shown form no part of the claimed design. 

CLAIM The ornamental design for a pad arrangement of a circuit module, as shown and described. 